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New/New. Brand New Original US Edition, Perfect Condition. Printed in English. Excellent Quality, Service and customer satisfaction guaranteed!
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Design and Modeling for 3D ICS and Interposers Hardcover - 2014
by Madhavan Swaminathan; Ki Jin Han
From the jacket flap
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.
Details
- Title Design and Modeling for 3D ICS and Interposers
- Author Madhavan Swaminathan; Ki Jin Han
- Binding Hardcover
- Pages 380
- Volumes 1
- Language ENG
- Publisher World Scientific Publishing Company, U.S.A
- Date 2014-01-01
- ISBN 9789814508599 / 9814508594
- Weight 1.45 lbs (0.66 kg)
- Dimensions 9 x 6 x 1 in (22.86 x 15.24 x 2.54 cm)
-
Themes
- Aspects (Academic): Science/Technology Aspects
- Dewey Decimal Code 621.381
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Design and Modeling for 3D ICs and Interposers
by Madhavan Swaminathan, Ki Jin Han
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System Integration and Modeling Concepts; Modeling of Cylind
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Design And Modeling For 3d Ics And Interposers
by Madhavan Swaminathan
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DESIGN AND MODELING FOR 3D ICS AND INTERPOSERS (Wspc Advanced Integration and Packaging)
by Swaminathan, Madhavan; Han, Ki Jin
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- Hardcover
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World Scientific Publishing Company. hardcover. New. 6x0x9. Brand New Book in Publishers original Sealing
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