Description:
Wiley & Sons, Incorporated, John, 1997. Hardcover. Acceptable. Missing dust jacket; Readable copy. Pages may have considerable notes/highlighting. ~ ThriftBooks: Read More, Spend Less.Dust jacket quality is not guaranteed.
CMOS Circuit Design, Layout, and Simulation by R. Jacob Baker - 1997-08-22
by R. Jacob Baker
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CMOS Circuit Design, Layout, and Simulation
by R. Jacob Baker
- Used
- Hardcover
Brand: Wiley-IEEE Press, 1997-08-22. 1. hardcover. Used:Good.
- Bookseller Ergodebooks (US)
- Format/Binding Hardcover
- Book Condition Used:Good
- Quantity Available 1
- Edition 1
- Binding Hardcover
- ISBN 10 0780334167
- ISBN 13 9780780334168
- Publisher Brand: Wiley-IEEE Press
- Date Published 1997-08-22
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CMOS Circuit Design, Layout, and Simulation
by R. Jacob Baker
- Used
- Acceptable
- Hardcover
- Condition
- Used - Acceptable
- Binding
- Hardcover
- ISBN 10 / ISBN 13
- 9780780334168 / 0780334167
- Quantity Available
- 1
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Seattle, Washington, United States
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CMOS Circuit Design, Layout and Simulation
by Baker, R. Jacob
- Used
- Condition
- Used - Good
- ISBN 10 / ISBN 13
- 9780780334168 / 0780334167
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- 1
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Reno, Nevada, United States
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Wiley & Sons, Incorporated, John. Used - Good. Used book that is in clean, average condition without any missing pages.
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CMOS Circuit Design, Layout, And Simulation
by Baker, R. Jacob
- Used
- Very Good
- Hardcover
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- Used - Very Good
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- Hardcover
- ISBN 10 / ISBN 13
- 9780780334168 / 0780334167
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- 1
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Bellingham, Massachusetts, United States
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Wiley-IEEE Press, 1997-08-21. Hardcover. Very Good. Hardcover. Very GoodFREE Media Mail Shipping on all U.S. orders over $ 25.00
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CMOS Circuit Design, Layout, and Simulation
by R. Jacob Baker
- Used
- Hardcover
- Condition
- Used: Good
- Edition
- 1
- Binding
- Hardcover
- ISBN 10 / ISBN 13
- 9780780334168 / 0780334167
- Quantity Available
- 1
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HOUSTON, Texas, United States
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Brand: Wiley-IEEE Press, 1997-08-22. 1. hardcover. Used: Good.
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CMOS Circuit Design, Layout, and Simulation
by Baker, R. Jacob & Harry W. Li & David E. Boyce
- Used
- Hardcover
- Condition
- Used - Good+ with No dust jacket as issued
- Binding
- Hardcover
- ISBN 10 / ISBN 13
- 9780780334168 / 0780334167
- Quantity Available
- 1
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Highland, New York, United States
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Wiley-IEEE Press. Good+ with No dust jacket as issued. 1997. Hardcover. 0780334167 . Foxing to page fore-edges. Great overall condition. Minor cosmetic wear. No noteworthy blemishes. No writing.; 163 X 53.2 X 238.5 millimeters; 902 pages .
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Cmos: Circuit Design, Layout, and Simulation (Series on Microelectronic Systems)
by Baker, R. Jacob et al
- Used
- Hardcover
- Condition
- Used
- Binding
- Hardcover
- ISBN 10 / ISBN 13
- 9780780334168 / 0780334167
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- 1
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Lincoln, Lincolnshire, United Kingdom
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A$35.74A$12.75 shipping to
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IEEE Press, 1997. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In fair condition, suitable as a study copy. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1550grams, ISBN:9780780334168
Item Price
A$35.74
A$12.75
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Stock Photo: Cover May Be Different
CMOS: Circuit Design, Layout, and Simulation (Series on Microelectronic Systems)
by Baker, R. Jacob
- Used
- Hardcover
- Condition
- Used
- Binding
- Hardcover
- ISBN 10 / ISBN 13
- 9780780334168 / 0780334167
- Quantity Available
- 1
- Seller
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Lincoln, Lincolnshire, United Kingdom
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A$35.74A$12.75 shipping to
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IEEE Press, 1998. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In fair condition, suitable as a study copy. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1550grams, ISBN:9780780334168
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CMOS Circuit Design, Layout, and Simulation
by R. Jacob Baker; Harry W. Li; David E. Boyce
- New
- Hardcover
- Condition
- New
- Binding
- Hardcover
- ISBN 10 / ISBN 13
- 9780780334168 / 0780334167
- Quantity Available
- 1
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San Diego, California, United States
- Item Price
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A$157.16A$5.45 shipping to
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Wiley-IEEE Press. Hardcover. New. New. In shrink wrap. Looks like an interesting title!
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