Description:
John Wiley & Sons , pp. 426 . Hardback. New.
Integrated Circuit, Hybrid, and Multichip Module P Package Design Guidelines – A Focus on Reliability by Michael Pecht - 1994
by Michael Pecht
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Integrated Circuit, Hybrid, and Multichip Module P Package Design Guidelines – A Focus on Reliability
by Michael Pecht
- New
- Hardcover
Wiley-Interscience, 1994. Hardcover. New. second printing edition. 426 pages. 9.75x6.50x1.25 inches.
-
Bookseller
Revaluation Books
(GB)
- Format/Binding Hardcover
- Book Condition New New
- Quantity Available 1
- Binding Hardcover
- ISBN 10 0471594466
- ISBN 13 9780471594468
- Publisher Wiley-Interscience
- Date Published 1994
We have 2 copies available starting at A$320.51.
Stock Photo: Cover May Be Different
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines
by Michael Pecht
- New
- Hardcover
- Condition
- New
- Binding
- Hardcover
- ISBN 10 / ISBN 13
- 9780471594468 / 0471594466
- Quantity Available
- 3
- Seller
-
Woodside, New York, United States
- Item Price
-
A$320.51A$3.99 shipping to
Show Details
Item Price
A$320.51
A$3.99
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Stock Photo: Cover May Be Different
Integrated Circuit, Hybrid, and Multichip Module P Package Design Guidelines – A Focus on Reliability
by Michael Pecht
- New
- Hardcover
- Condition
- New
- Binding
- Hardcover
- ISBN 10 / ISBN 13
- 9780471594468 / 0471594466
- Quantity Available
- 2
- Seller
-
Exeter, Devon, United Kingdom
- Item Price
-
A$337.81A$10.00 shipping to
Show Details
Description:
Wiley-Interscience, 1994. Hardcover. New. second printing edition. 426 pages. 9.75x6.50x1.25 inches.
Item Price
A$337.81
A$10.00
shipping to
