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Boston: Kluwer Academic Publishers, 1999. Name from previous owner on FEP. No dust jacket. Binding is very well preserved, pages are clean and crisp, and printing is tight, clean and bright throughout. MB. hardcover. Good/No Dust Jacket. Used.
Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications by Dean L. Monthei - pp. 252
by Dean L. Monthei
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Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications
by Dean L. Monthei
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Springer , pp. 252 . Hardback. Used.
- Bookseller Cold Books (US)
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- ISBN 10 0792383648
- ISBN 13 9780792383642
- Publisher Springer
- Date Published pp. 252
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Package Electrical Modeling, Thermal Modeling and Processing for GaAs Wireless Applications
by Monthei, Dean L
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Package Electrical Modeling, Thermal Modeling, and Processing st 1
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Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications
by Monthei, Dean L
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Boston: Kluwer Academic Publishers. Very Good with no dust jacket. 1999. Hardcover. 0792383648 . Library stamps/marks/labels/pocket, otherwise light wear. Solid hardcover.; "Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications reviews the practical aspects of electrical and thermal modeling of packages and has no equivalent on the market, since it discusses analog (microwave) packaging as opposed to digital packaging. This book emphasizes low-cost industry-standard packages; however, the principles translate well to other categories of packages. The need for this book arises from the fact that low-cost packages have not been optimized for high-frequency use. With high-volume commercial wireless markets now expanding and cost reduction a primary concern, the interest in modeling as a significant cost-cutting tool is high. Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications addresses this interest and…
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PACKAGE ELECTRICAL MODELING, THERMAL MODELING, AND PROCESSING FOR GAAS WIRELESS APPLICATIONS (ELECTRONIC PACKAGING AND INTERCONNECTS)
by DEAN L. MONTHEI,
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Package Electrical Modeling, Thermal Modeling, and Processing for Gaas Wireless Applications
by Monthei, Dean L
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Secaucus, New Jersey, U.S.A.: Kluwer Academic Pub, 1998 hardback book in near fine condition. Hardcover. Near Fine.
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Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications
by Dean L. Monthei
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Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications (Electronic Packaging and Interconnects, 2)
by Monthei, Dean L
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