Description:
Wiley-Interscience, 1999. Hardcover. New. 1st edition. 297 pages. 9.75x6.50x0.75 inches.
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SemiConductor Wafer Bonding Science and Technology Hardcover - 1998 - 1st Edition
by Q.-Y Tong; U. Gösele
First line
"Wafer bonding" generally refers to a process by which two mirror-polished wafers adhere to each other at room temperature without the application of any macroscopic gluing layer or outside force.
From the rear cover
A one-stop resource on all aspects of semiconductor wafer bonding for materials scientists and electrical engineers
Semiconductor Wafer Bonding addresses the entire spectrum of mainstream and likely future applications of wafer bonding. It examines all of the important issues surrounding this technology, including basic interactions between flat surfaces, the influence of particles, surface steps and cavities, surface preparation and room-temperature wafer bonding, thermal treatment of bonded wafer pairs, and much more. This unique, one-stop resource consolidates information previously available only by time-consuming searches through technical journals, proceedings, and book chapters for more than 1,000 published articles on wafer bonding. It covers all materials used for wafer bonding-including silicon, III-V compounds, fused and crystalline quartz, glass, silicon carbide, sapphire, ferroelectrics, and many others. For materials scientists and electrical engineers who need to exploit the potential of this flourishing technology, Semiconductor Wafer Bonding is a convenient one-stop resource for answers to many common questions. It is also an excellent text/reference for graduate students eager to learn about this interdisciplinary field, which spans surface chemistry, solid-state physics, materials science, and electrical engineering.Details
- Title SemiConductor Wafer Bonding Science and Technology
- Author Q.-Y Tong; U. Gösele
- Binding Hardcover
- Edition number 1st
- Edition 1
- Pages 320
- Language ENG
- Publisher Wiley-Interscience
- Date November 23, 1998
- Features Illustrated, Index
- ISBN 9780471574811
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Semiconductor Wafer Bonding – Science and Technology
by Tong, Q. Y./ Gosele, U./ Electrochemical Society (Corporate Author)
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Semiconductor Wafer Bonding: Science and Technology Tong, Q.-Y. and Gösele, U.
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In overall good condition, no pages missing. Shipping can take between 2-6weeks for international deliveries. Hardback copies may or may not have dust jackets, please get in contact for more information.
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SemiConductor Wafer Bonding
by U. Gösele Q.–Y. Tong Q.Y. Tong
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John Wiley & Sons , pp. 320 1st Edition . Hardback. New.
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SemiConductor Wafer Bonding: Science and Technology
by Tong, Q.-Y.; Gösele, U
- New
- Hardcover
- Condition
- New
- Binding
- Hardcover
- ISBN 10 / ISBN 13
- 9780471574811 / 0471574813
- Quantity Available
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Wiley-Interscience, 1998-11-23. Hardcover. New. New. In shrink wrap. Looks like an interesting title!
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