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Microfluidic System Interfacing: An overview on packaging of microfluidic systems, how to interface them fluidically, electrically and optically.

Microfluidic System Interfacing: An overview on packaging of microfluidic systems, how to interface them fluidically, electrically and optically.

Microfluidic System Interfacing: An overview on packaging of microfluidic
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Microfluidic System Interfacing: An overview on packaging of microfluidic systems, how to interface them fluidically, electrically and optically. Paperback - 2011

by Perozziello, Gerardo

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paperback. Good. Access codes and supplements are not guaranteed with used items. May be an ex-library book.
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Details

  • Title Microfluidic System Interfacing: An overview on packaging of microfluidic systems, how to interface them fluidically, electrically and optically.
  • Author Perozziello, Gerardo
  • Binding Paperback
  • Condition Used - Good
  • Pages 96
  • Volumes 1
  • Language ENG
  • Publisher LAP Lambert Academic Publishing
  • Publication date 2011
  • Bookseller's Inventory # 3844327703.G
  • ISBN 9783844327700 / 3844327703
  • Weight 0.34 lbs (0.15 kg)
  • Dimensions 9 x 6 x 0.23 in (22.86 x 15.24 x 0.58 cm)
  • Category Technology & Industrial Arts
  • Quantity available 1

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Reader reviews for Microfluidic System Interfacing: An overview on packaging of microfluidic systems, how to interface them fluidically, electrically and optically.

From the publisher

The field related to the development of microfluidic systems performing bio-chemical analysis is continuously growing. Careful packaging of microsystems is vital to ensure efficient work of the device, especially at the interface between the system and the environment, where fluidic, electrical and optical interconnections must be provided. The book investigates new packaging solutions to interface the microfluidic systems with the outer world. It also shows how to fabricate and test a fluidic motherboard for microfluidic devices. The book can be divided in three parts: - Specifying the definition of packaging: what characterizes it, the weak points and difficulties and all the parameters involved and important to fulfill a successful protection and interface of a system. - Developing models regarding the critical parameters in packaging to ease the design and dimensioning of fluidic and optical interconnections. - Design, fabricate and testing a microfluidic motherboard that integrates polymer-based waveguides, external optical connector plugs and fluidic networks providing an interface between microfluidic systems and the outer world.
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