Modeling and Simulation for Microelectronic Packaging Assembly Hardback - 2011 - 1st Edition
by Shen Liu
- New
- Hardback
A$214.21
A$15.60
Delivery to USA
Standard delivery: 7 to 12 days
More delivery options
Standard delivery: 7 to 12 days
Ships from Ria Christie Collections (Greater London, United Kingdom)
Details
- Title Modeling and Simulation for Microelectronic Packaging Assembly
- Author Shen Liu
- Binding Hardback
- Edition number 1st
- Edition 1
- Condition New
- Pages 576
- Volumes 1
- Language ENG
- Publisher Wiley
- Publication date 2011-05-17
- Features Bibliography, Illustrated, Index, Table of Contents
- Bookseller's Inventory # ria9780470827802_inp
- ISBN 9780470827802 / 0470827807
- Weight 2.5 lbs (1.13 kg)
- Dimensions 9.8 x 6.9 x 1.3 in (24.89 x 17.53 x 3.30 cm)
- Category Technology & Industrial Arts
- Library of Congress subjects TECHNOLOGY & ENGINEERING / Electronics /, Microelectronic packaging - Simulation
- Library of Congress Catalogue Number 2011019534
- Dewey Decimal Code 621.381
- Quantity available 860
About Ria Christie Collections Greater London, United Kingdom
Biblio member since 2014
Hello We are professional online booksellers. We sell mostly new books and textbooks and we do our best to provide a competitive price. We are based in Greater London, UK. We pride ourselves by providing a good customer service throughout, shipping the items quickly and replying to customer queries promptly. Ria Christie Collections
30 day return guarantee, with full refund including original shipping costs for up to 30 days after delivery if an item arrives misdescribed or damaged.
Reader reviews for Modeling and Simulation for Microelectronic Packaging Assembly
Write a review for this book
Important Terms and Guidelines
- Please focus on the book’s content and context. Also, add any personal comments as to how you enjoyed the book. Substantiate your likes and dislikes. You may make comparisons to other books.
- Reviews must be at least 140 characters in length.
- Please do not reveal critical plot elements.
- This is not a help line. Contact customer support if you need help.
Your review must not include:
- Obscenities, discriminatory language, or other insulting language not suitable for public domain
- Advertisements, “spam” content, or references to other products, offers or websites.
- Email addresses, URLs, phone numbers, physical addresses or other contact information.
- Overly critical comments about other reviews or reviewers
- Time-sensitive material (i.e. promotional tours, seminars, lectures, etc.)
- Availability, price, or alternative ordering/shipping information
From the rear cover
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter.
- Models and simulates numerous processes in manufacturing, reliability and testing for the first time
- Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing
- Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products
- Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects
- Appendix and color images available for download from the book's companion website
Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource.
Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
