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Reliability Of Microtechnology

Reliability Of Microtechnology

Reliability Of Microtechnology
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Reliability Of Microtechnology Hardback - 2011 - 2011th Edition

by Johan Liu; Olli Salmela; Jussi Sarkka

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New/New. Brand New Original US Edition, Perfect Condition. Printed in English. Excellent Quality, Service and customer satisfaction guaranteed!
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Details

  • Title Reliability Of Microtechnology
  • Author Johan Liu; Olli Salmela; Jussi Sarkka
  • Binding Hardback
  • Edition number 2011th
  • Edition 2011
  • Condition New
  • Pages 204
  • Volumes 1
  • Language ENG
  • Publisher Springer
  • Publication date 2011-02-14
  • Illustrated Yes
  • Features Illustrated
  • Bookseller's Inventory # BIBNNA-160222
  • ISBN 9781441957597 / 1441957596
  • Weight 1.07 lbs (0.49 kg)
  • Dimensions 9.21 x 6.14 x 0.56 in (23.39 x 15.60 x 1.42 cm)
  • Themes
    • Aspects (Academic): Science/Technology Aspects
  • Category Technology & Industrial Arts
  • Library of Congress Catalogue Number 2011920685
  • Dewey Decimal Code 621.381
  • Quantity available 1

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Reader reviews for Reliability Of Microtechnology

From the publisher

Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail.

The book also includes exercises and detailed solutions at the end of each chapter.

From the rear cover

Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail. The book also:

  • Discusses the general failure mechanisms of microsystems on a component level
  • Offers comprehensive coverage of solder joint reliability at the microsystems level
  • Analyzes�quality issues and manufacturing at the microsystems level

Reliability of Microtechnology is an ideal volume for researchers and professional engineers working in reliability and manufacturing. The book also includes exercises and detailed solutions at the end of each chapter.

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