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Silicon Semiconductor Technology: Processing and Integration of Microelectronic Devices

Silicon Semiconductor Technology: Processing and Integration of Microelectronic Devices

Silicon Semiconductor Technology: Processing and Integration of Microelectronic
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Silicon Semiconductor Technology: Processing and Integration of Microelectronic Devices Papeback -

by Ulrich Hilleringmann

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Springer , 1st Edition . Papeback. New.
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Details

  • Title Silicon Semiconductor Technology: Processing and Integration of Microelectronic Devices
  • Author Ulrich Hilleringmann
  • Binding Papeback
  • Condition New
  • Pages 264
  • Volumes 1
  • Language ENG
  • Publisher Springer
  • Publication date 1st Edition
  • Bookseller's Inventory # 6396299790
  • ISBN 9783658410407 / 365841040X
  • Weight 1.24 lbs (0.56 kg)
  • Category Technology & Industrial Arts
  • Quantity available 4

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Reader reviews for Silicon Semiconductor Technology: Processing and Integration of Microelectronic Devices

From the publisher

The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation, etching, doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail, beginning with the purification of silicon up to the encapsulated integrated circuit. It includes modern processes like atomic layer deposition and etching for nanoscale structures and compares improvements like silicide contacts, copper metallization, high-k dielectrics, and SOI and FINFET structures. All processes are presented looking from the process engineer's view.

From the rear cover

The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation, etching, doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail, beginning with the purification of silicon up to the encapsulated integrated circuit. It includes modern processes like atomic layer deposition and etching for nanoscale structures and compares improvements like silicide contacts, copper metallization, high-k dielectrics, and SOI and FINFET structures. All processes are presented looking from the process engineer's view.


The Content

  • Wafer fabrication
  • Thermal oxidation
  • Lithography
  • Etching technology
  • Doping techniques
  • Chemical and Physical Deposition
  • Metallization and Contacts


About the AuthorProf. Dr.-Ing. Ulrich Hilleringmann has been teaching semiconductor technology, microelectromechanical systems, sensor technology and optoelectronic system integration since 1989


About the author

About the Author

Prof. Dr.-Ing. Ulrich Hilleringmann has been teaching semiconductor technology, microelectromechanical systems, sensor technology and optoelectronic system integration since 1989.


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