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Thermal and Structural Electronic Packaging Analysis for Space and Extreme
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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments Hardback - 2021

by Juan Cepeda-Rizo; Jeremiah Gayle; Joshua Ravich

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From the publisher

This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.

Details

  • Title Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
  • Author Juan Cepeda-Rizo; Jeremiah Gayle; Joshua Ravich
  • Binding Hardback
  • Pages 290
  • Volumes 1
  • Language ENG
  • Publisher CRC Press
  • Publication date 2021-12-30
  • Illustrated Yes
  • Features Bibliography, Illustrated, Index
  • ISBN 9781032160818 / 1032160810
  • Weight 1.33 lbs (0.60 kg)
  • Dimensions 9.21 x 6.14 x 0.69 in (23.39 x 15.60 x 1.75 cm)
  • Category Technology & Industrial Arts
  • Library of Congress subjects Electronic packaging, Extreme environments
  • Library of Congress Catalogue Number 2021031791
  • Dewey Decimal Code 621.381

About the author

Juan Cepeda-Rizo obtained his bachelor's degree in mechanical engineering and master's in materials engineering from Cal Poly, San Luis Obispo in 1997. After graduation he worked for a semiconductor company doing electronic packaging analysis. He received his Ph.D. from Claremont Graduate University in Applied Mathematics in and in 2008 worked for NASA's Jet Propulsion Laboratory as a thermal system engineer where his latest responsibilities included thermal and structural analysis of flight electronics.

Jeremiah Gayle obtained his bachelor's degree in mechanical engineering from Arizona State University, and master's degrees from Iowa State, and John Hopkins University in space systems engineering. He is pursuing a doctorate in aerospace engineering from Colorado State University and works at NASA's Jet Propulsion Laboratory where he works on spacecraft systems and conducts thermal and structural analysis of avionics.

Joshua Ravich is a supervisor for the Technology Infusion group at JPL, where he works on the mechanical design and analysis of spacecraft systems. His recent work has included the Mars Helicopter project. He received a bachelor's degree in mechanical Engineering from UC Berkeley and a master's in mechanical and aerospace engineering from the University of Michigan.

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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments...
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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems)

by Cepeda-rizo, Juan; Gayle, Jeremiah; Ravich, Joshua

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CRC Press, 2022. 1st Edition (2022.) 8vo paperback with 289 pages. Signed on the front free endpaper,"To Aunt Bonnie, Jeremiah Gayle." The book is in very good condition very slight shelf wear. Interior clean and tight. No online access or CD-ROM or digital access codes if applicable! "Have you ever wondered how NASA designs, builds, and tests spacecrafts and hardware for space? How is it that wildly successful programs such as the Mars Exploration Rovers could produce a rover that lasted over ten times the expected prime mission duration? Or build a spacecraft designed to visit two orbiting destinations and last over 10 years when the fuel ran out? This book was written by NASA/JPL engineers with experience across multiple projects, including the Mars rovers, Mars helicopter." Black spine/White text. . Signed. 1st Edition. Hardcover. Very Good/No DJ Issued. 8vo. Engineering / Structural Space.
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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems)

by Cepeda-rizo, Juan; Gayle, Jeremiah; Ravich, Joshua

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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

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