Home Mems/Moem Packaging: Concepts, Designs, Materials and Processes by Ken Gilleo (ISBN: 9780071455565)

Stock photo: cover may vary

Mems/Moem Packaging: Concepts, Designs, Materials and Processes Hardback - 2005 - 1st Edition

Name: Mems/Moems Packaging : Concepts, Designs, Materials, and Processes
Price: 17.61 USD
Availability: InStock
Author: Ken Gilleo
ISBN: 9780071455565

by Ken Gilleo

Add to wish list

Browse more copies for sale ↓

Reader reviews for Mems/Moem Packaging: Concepts, Designs, Materials and Processes

Write a review for this book

Important Terms and Guidelines

Please focus on the book’s content and context. Also, add any personal comments as to how you enjoyed the book. Substantiate your likes and dislikes. You may make comparisons to other books.
Reviews must be at least 140 characters in length.
Please do not reveal critical plot elements.
This is not a help line. Contact customer support if you need help.

Your review must not include:

Obscenities, discriminatory language, or other insulting language not suitable for public domain
Advertisements, “spam” content, or references to other products, offers or websites.
Email addresses, URLs, phone numbers, physical addresses or other contact information.
Overly critical comments about other reviews or reviewers
Time-sensitive material (i.e. promotional tours, seminars, lectures, etc.)
Availability, price, or alternative ordering/shipping information

From the publisher

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.

While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.

From the rear cover

This is a rigorous examination of design concepts, fabrication processes, and properties of materials used in MEMS and MOEMS package construction and assembly, detailing routing, electrical performance, thermal management, hermeticity level, and reliability. The author also describes advanced packaging methods, including:

Wafer-level packaging
Microfluidic device packaging
Optical MEMS packaging
RF and microwave packaging
Laser sealing

Readers will find in-depth coverage of assembly technology and manufacturability, including cost issues.

CONTENT THAT SOLVES MEMS AND MOEMS PACKAGING & ASSEMBLY PROBLEMS:

Engineering fundamentals of packaging for MEMS and MOEMS devices
Principles, materials, and fabrication of MEMS and MOEMS devices
Evaluation methods for MEMS and MOEMS packaging challenges
MEMS packaging processes
From MEMS and MOEMS to nanotechnology

Details

Title Mems/Moem Packaging: Concepts, Designs, Materials and Processes
Author Ken Gilleo
Binding Hardback
Edition number 1st
Edition 1
Pages 240
Volumes 1
Language ENG
Publisher McGraw-Hill Companies
Publication date 2005-08-01
Illustrated Yes
Features Bibliography, Illustrated, Index, Table of Contents
ISBN 9780071455565 / 0071455566
Weight 1.07 lbs (0.49 kg)
Dimensions 9.12 x 6.32 x 0.85 in (23.16 x 16.05 x 2.16 cm)
Category Technology & Industrial Arts
Library of Congress subjects Optoelectronic devices, Microelectronic packaging
Library of Congress Catalogue Number 2005049594
Dewey Decimal Code 621.381

About the author

Ken Gilleo, Ph.D., is the CEO of ET-Trends, a consulting, packaging design, and IP firm specializing in emerging technologies. The firm's projects include novel materials and packages and processes for MEMS, MOEMS, and optoelectronics. Dr. Gilleo is a member of IEEE and IMAPS, and he is also Vice President of Technical Programs for the Surface Mount Technology Association (SMTA). He has been actively involved in the development of new products for 30 years and is an inventor in circuitry, electronics materials, and packaging. Dr. Gilleo has 30 U.S. patents, and his products have received three R&D 100 Awards. Dr. Gilleo resides in Warwick, Rhode Island.

More Copies for Sale

Mems/Moems Packaging : Concepts, Designs, Materials, and Processes

by Ken Gilleo

Used
as new
Hardback

Condition: New
Binding: Hardcover
ISBN 10 / ISBN 13: 9780071455565 / 0071455566
Quantity available: 1
Seller: ThriftBooks

Biblio Top Seller
Item price: A$25.57

Free Delivery to USA

Show details

Description:

McGraw-Hill Professional Publishing, 2005. Hardcover. As New. Disclaimer:An apparently unread copy in perfect condition. Dust cover is intact; pages are clean and are not marred by notes or folds of any kind. At ThriftBooks, our motto is: Read More, Spend Less.Dust jacket quality is not guaranteed.

Add to wish list

Item price

A$25.57

Free Delivery to USA

Stock photo: cover may vary

MEMS/MOEM Packaging: Concepts, Designs, Materials and Processes (Mcgraw-Hill Nanoscience and Technology)

by Gilleo, Ken

Used
Good
Hardback

Condition: Good
Binding: Hardcover
ISBN 10 / ISBN 13: 9780071455565 / 0071455566
Quantity available: 1
Seller: Bonita
Item price: A$65.98

Free Delivery to USA

Show details

Description:

hardcover. Good. Access codes and supplements are not guaranteed with used items. May be an ex-library book.

Add to wish list

Item price

A$65.98

Free Delivery to USA

Stock photo: cover may vary