Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials Mechan Hardback - 2007 - 1st Edition

Dr. Ephraim Suhir is Distinguished Member of Technical Staff (retired), Basic Research, Physical Sciences and Engineering Research Division, Bell Labs, Murray Hill, NJ. He is currently on the faculty of the Electrical Engineering Department, University of California, Santa Cruz, CA and the Department of Mechanical Engineering, University of Maryland, College Park, MD. Dr. Suhir is Fellow of the American Physical Society (APS), the Institute of Electrical and Electronics Engineers (IEEE), the American Society of Mechanical Engineers (ASME), and the Society of Plastics Engineers (SPE). He is co-founder (with Dr. Peter Engel) of the ASME Journal of Electronic Packaging and served as its Technical Editor for eight years (1993-2001). He has received numerous distinguished service and professional awards, including 2004 ASME Worcester Read Warner Medal for outstanding contributions to the permanent literature of engineering; 2001 IMAPS John A. Wagnon Technical Achievement Award for outstanding contributions to the technical knowledge of the microelectronics, optoelectronics, and packaging industry; 2000 IEEE-CPMT Outstanding Sustained Technical Contribution Award for outstanding, sustained and continuing contributions to the technologies in fields encompassed by the CPMT Society; 2000 SPE International Engineering/Technology (Fred O. Conley) Award for outstanding pioneering and continuing contributions to plastics engineering; and 1999 ASME and Pi-Tau-Sigma Charles Russ Richards Memorial Award for outstanding contributions to mechanical engineering.

Prof. C. P. Wong is a Regents' Professor and the Charles Smithgall Institute Endowed Chair at the School of Materials Science and Engineering at Georgia Institute of technology. After his doctoral study, he was awarded a two-year postdoctoral fellowship with Nobel Laureate Professor Henry Taube at Stanford University. He joined AT&T Bell Laboratories in 1977 as a member of the technical staff and in 1992, he was elected as an AT&T Bell Laboratories Fellow for his fundamental contributions to low-cost high performance plastic packaging of semiconductors. Since 1996, he is a Professor at the School of Materials Science and Engineering at the Georgia Institute of Technology. He has received many awards, among those, the AT&T Bell Labs Fellow Award in 1992, the IEEE CPMT Society Outstanding and Best Paper Awards in 1990, 1991, 1994, 1996, 1998, 2002, the IEEE CPMT Society Outstanding Sustained Technical Contributions Award in 1995, the IEEE Third Millennium Medal in 2000, the IEEE EAB Education Award in 2001, the IEEE CPMT Society Exceptional Technical Contributions Award in 2002 and the IEEE Components, Packaging and Manufacturing Technology Field Award in 2006. Dr. Wong is a Fellow of the IEEE, AIC, and AT&T Bell Labs, and was the technical vice president (1990 &1991), and the president of the IEEE-CPMT Society (1992 &1993). He was elected a member of the National Academy of Engineering in 2000.

Professor Y. C. Lee is a Professor of Mechanical Engineering. He was the Chair of ASME Electronic and Photonic Packaging Division (EPPD) from 2004 to 2005. From 1993 to 2002, he was an Associate Director of the Center for Advanced Manufacturing and Packaging of Microwave, Optical and Digital Electronics, University of Colorado at Boulder. Prior to joining the University in 1989, he was a Member of Technical Staff at AT&T Bell Laboratories, Murray Hill, New Jersey. Dr. Lee was an Associated Editor of ASME Journal of Electronic Packaging from 2001 to 2004 and a Guest Editor for IEEE Transaction on Advanced Packaging in 2003 and 2005. He has received several awards: ASME Fellow, December 2002, Presidential Young Investigator (National Science Foundation, 1990), Outstanding Young Manufacturing Engineer Award (SME, 1992), Outstanding Paper Award (IEEE-ECTC, 1991), Outstanding Paper Award (ASME J. of Electronic Packaging, 1993), IEEE Transactions on Advanced Packaging Honorable Mention Paper Award, 2003