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Area Array Interconnection Handbook
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Area Array Interconnection Handbook Hardback - 2001

by Paul Totta; Karl J. Puttlitz; Karl J. Puttlitz (Editor)

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Reader reviews for Area Array Interconnection Handbook

From the publisher

This handbook provides a comprehensive treatment of area-array interconnections for both chips and microelectronic packages in terms of optimizing densification, functionality and reliability. It provides comparisons with alternative and competing technologies, clearly defining cost versus benefit tradeoffs and strategies. Process details are defined in the order of their typical manufacturing sequence, indicating tooling requirements and potential yield detractors. In addition, the handbook has individual chapters devoted to supporting disciplines that play a key role in satisfying the requirements of microelectronic package applications: efficient thermal-dissipation techniques, metallurgical and mechanical characteristics of interconnections and electrical design strategies. Area-array technology at both die and chip carrier levels offers the best opportunity of satisfying the demanding performance requirements that users at all levels of the product spectrum have come to expect.

First line

The concept of interconnecting a chip to a package in a face-down or "flip chip" orientation is simple enough, and forty years old.

Details

  • Title Area Array Interconnection Handbook
  • Author Paul Totta; Karl J. Puttlitz; Karl J. Puttlitz (Editor)
  • Binding Hardback
  • Edition U.S. Edition
  • Pages 1188
  • Volumes 1
  • Language ENG
  • Publisher Springer
  • Publication date September 1, 2001
  • Illustrated Yes
  • ISBN 9780792379195 / 0792379195
  • Weight 4.07 lbs (1.85 kg)
  • Category Technology & Industrial Arts
  • Library of Congress Catalogue Number 2001018653
  • Dewey Decimal Code 621.381