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Solidification Processing of Metallic Alloys Under External Fields Hardback - 2018
by Dmitry G. Eskin (Editor); Jiawei Mi (Editor)
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From the publisher
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This book explores the application of external physical fields to the solidification processing of metallic alloys. Leading academics from around the world present comprehensive and critical reviews on state-of-the-art research and discuss possible future directions. Major physical fields, including electromagnetic, electric, acoustic, and thermal, are considered. In addition, the most advanced synchrotron X-ray based real-time and in-situ studies and numerical modeling methodologies are reviewed and discussed, with a special emphasis on their applications to the solidification processes. Throughout, all chapters are illustrated with both historical and very recent research cases, including typical examples of in-situ studies, modeling, and simulation. This book contains essential knowledge and information suitable for a wide audience, from undergraduate and postgraduate students to academics, practicing researchers, and engineers in materials, metallurgy, and manufacturing.
- Presents state-of-the-art research in an important and fast-growing field
- Covers fundamental theory, real-time characterization, modeling, and applications
- Features a combination of original results and systematic review of published literature by the leading researchers in the world
- Represents a comprehensive reference for researchers and engineers working in materials processing
Details
- Title Solidification Processing of Metallic Alloys Under External Fields
- Author Dmitry G. Eskin (Editor); Jiawei Mi (Editor)
- Binding Hardback
- Pages 320
- Volumes 1
- Language ENG
- Publisher Springer
- Publication date 2018-10-20
- Illustrated Yes
- Features Illustrated
- ISBN 9783319948416 / 3319948415
- Weight 1.41 lbs (0.64 kg)
- Dimensions 9.21 x 6.14 x 0.75 in (23.39 x 15.60 x 1.91 cm)
- Dewey Decimal Code 530.474
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Solidification Processing of Metallic Alloys Under External Fields (Springer Series in Materials Science, 273)
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