BIBLIO is the largest independent book marketplace in the world, with over 100 million books.

Skip to content

AREA ARRAY INTERCONNECTION HANDBOOK (HB 2001)

AREA ARRAY INTERCONNECTION HANDBOOK (HB 2001)

AREA ARRAY INTERCONNECTION HANDBOOK (HB 2001)
Stock photo: cover may vary

AREA ARRAY INTERCONNECTION HANDBOOK (HB 2001) Hardback - 2001

by PUTTLITZ K

Add to wish list
  • New
New

Description

USA Edition . New. Brand New! Fast Delivery US Edition and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 6-10 days and we do have flat rate for up to 2LB. Extra shipping charges will be requested if the Book weight is more than 5 LB. This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability.
Add to wish list
This copy is temporarily unavailable. Please check back later or see below for alternate copies of this book, if available. You can also add this book to your want list and we will notify you if this book becomes available again or we locate other copies:

Reader reviews for AREA ARRAY INTERCONNECTION HANDBOOK (HB 2001)

From the publisher

This handbook provides a comprehensive treatment of area-array interconnections for both chips and microelectronic packages in terms of optimizing densification, functionality and reliability. It provides comparisons with alternative and competing technologies, clearly defining cost versus benefit tradeoffs and strategies. Process details are defined in the order of their typical manufacturing sequence, indicating tooling requirements and potential yield detractors. In addition, the handbook has individual chapters devoted to supporting disciplines that play a key role in satisfying the requirements of microelectronic package applications: efficient thermal-dissipation techniques, metallurgical and mechanical characteristics of interconnections and electrical design strategies. Area-array technology at both die and chip carrier levels offers the best opportunity of satisfying the demanding performance requirements that users at all levels of the product spectrum have come to expect.

First line

The concept of interconnecting a chip to a package in a face-down or "flip chip" orientation is simple enough, and forty years old.

Details

  • Title AREA ARRAY INTERCONNECTION HANDBOOK (HB 2001)
  • Author PUTTLITZ K
  • Binding Hardback
  • Edition USA Edition
  • Condition New
  • Pages 1188
  • Volumes 1
  • Language ENG
  • Publisher Springer
  • Publication date September 1, 2001
  • Illustrated Yes
  • Bookseller's Inventory # Cvs 9780792379195
  • ISBN 9780792379195 / 0792379195
  • Weight 4.07 lbs (1.85 kg)
  • Category Technology & Industrial Arts
  • Library of Congress Catalogue Number 2001018653
  • Dewey Decimal Code 621.381
  • Quantity available 1