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Failure Analysis of Integrated Circuits: Tools and Techniques (The Springer International Series in Engineering and Computer Science, 494)

Failure Analysis of Integrated Circuits: Tools and Techniques (The Springer International Series in Engineering and Computer Science, 494)

Failure Analysis of Integrated Circuits: Tools and Techniques (The Springer
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Failure Analysis of Integrated Circuits: Tools and Techniques (The Springer International Series in Engineering and Computer Science, 494) Hardback - 1999

by Wagner, Lawrence C

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Springer, 1999-01-31. 1999. hardcover. New. 6.42x0.87x9.48. Buy with confidence. Excellent Customer Service & Return policy.
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Reader reviews for Failure Analysis of Integrated Circuits: Tools and Techniques (The Springer International Series in Engineering and Computer Science, 494)

From the publisher

Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique.
Failure Analysis of Integrated Circuits: Tools and Techniques is a must have' reference work for semiconductor professionals and researchers.

First line

Failure analysis can be defined as a diagnostic process for determining the cause of a failure.
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